High leakage currents and soft reverse current - voltage characteristics are some of the detrimental effects produced by the metal atoms dissolved in the silicon matrix . gettering procedures can reduce metal contamination 由于金屬雜質(zhì)原子擴散并沉積在器件的有源區(qū),會造成諸如:反向漏電流較大,反向擊穿電壓是軟擊穿等有害的影響。
Electroplating : the electrochemical deposition of reduced metal ions from an electrolytic solution onto the cathode by applying a dc current through the electrolytic solution between two electrodes , cathode and anode , respectively 電鍍:在電解質(zhì)溶液中的兩個電極,陰極和陽極之間施加直流電,使電解質(zhì)溶液中的金屬離子還原沉積在陰極上的電化學沉積過程。